Potting and encapsulation are used to fill or immerse electronic components with a compound of usually two-component materials, like the epoxy resin and hardeners, in order to protect against shocks, vibrations, moisture and corrosive agents. The component materials are filled from separate storage tanks, have to be accurately and uniformly mixed to ensure that the whole process is consistent and repeatable. Some important factors also have to be considered, like components ratio and temperature, the mixing of materials, force, volume, speed, among others. Illustrative pics: